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- Flip Chip technology is a typical application. 倒裝芯片技術(shù)就是其中一個(gè)典型應用。
- As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 當電流通過(guò)焊點(diǎn)時(shí)，會(huì )伴隨產(chǎn)生焦耳熱效應和電遷移效應。
- A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 關(guān)于單遍高可靠性倒裝片回流密封劑領(lǐng)域研發(fā)工作成就的綜述。
- The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦討論在覆晶焊點(diǎn)中之電流聚集效應及其溫度分布。
- Jets of compressed air lift the hovercraft off the ground, and flexible skirts around the craft retain the air cushion, and help to keep it stable. 壓縮空氣的噴射氣流將氣墊船浮在地面上，船的四周有柔性圍裙來(lái)維持氣墊并使氣墊船穩定。
- Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC. 采用通用有限元軟件MSC.
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成電路封裝（叩焊芯片）內部實(shí)際的電氣連接的焊料中的鉛。
- Under the comparable conditions, the gas hold up was compared with that of common round air lift internal loop reactors,square or round bubble columns. 在同等可比條件下，將其與普通同心圓型氣升式內環(huán)流反應器及方型、圓型鼓泡塔的氣含率作了比較，對實(shí)驗結果進(jìn)行了關(guān)聯(lián)。
- Utilization of flip chip as cost-effective interconnect technology requires innovative handling, test methods and processes for KGD. 倒裝芯片是一種性能價(jià)格比良好的互連技術(shù) ,要求采用富有創(chuàng )新的操作 ,以滿(mǎn)足KGD的測試方法和操作工藝的需要。
- The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本課題受到國家自然科學(xué)基金重大項目“先進(jìn)電子制造中的重要科學(xué)技術(shù)問(wèn)題研究”的資助,專(zhuān)門(mén)針對RFID倒裝芯片封裝設備中的預綁定模塊進(jìn)行視覺(jué)系統和運動(dòng)控制集成的研究。
- Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. 介紹了幾種當前先進(jìn)的MEMS封裝技術(shù):倒裝焊MEMS、多芯片 (MCP)和模塊式封裝(MOMEMS)。
- Discuss the necessary of flip chip underfill to ther mal fatigue failures.Put forward controlling parameter for flip chip underfill. [摘要]從熱疲勞故障的角度論述了倒裝芯片底部填充的必要性 ，介紹了倒裝芯片底部填充的參數控制。
- Some typical applications in under bump metallurgy(UBM)for flip chip bumping,PC boards,LCRs and computer hard disk are reviewed. 指出,減少污染、延長(cháng)鍍液使用壽命、降低成本仍然是化學(xué)鍍鎳面臨的一項長(cháng)期的任務(wù);
- The gap is caused by air lifting a corner of the blanket up. 這個(gè)縫隙是由大氣掀起保溫毯的一角造成的。
- CTE mismatch between silicon and BT board is so colossal that flip chip need filling underfill to keep the long-term reliability. 因覆晶封裝結構中的矽晶片與有機基板間的熱膨脹系數差異頗大，故需填充底膠以確保其長(cháng)時(shí)可靠性。
- Air lift surface parcel. 陸空聯(lián)運包裹。
- A flip chip type semiconductor device is provided with a semiconductor chip with a plurality of pad electrodes on one surface. 一種芯片倒裝型半導體器件，其配備的半導體芯片的表面上有多個(gè)焊盤(pán)電極。
- In view of Sulige gas field's characteristi of low pressure, low output, producing water, this paper introduces mechanism of plunger air lift, plunger selection for Su Lige gas field. 摘要根據蘇里格氣田低壓、低產(chǎn)、氣井產(chǎn)水的特點(diǎn)，介紹了柱塞氣舉的機理及蘇里格氣田柱塞的選型。
- Compared to its predecessor, the TAL 10000, the TAL 20000 is claimed to ‘provide a quantum jump’ in flip chip assembly technology for RFID inlays. 相比，它的前身，塔爾阿萬(wàn)，塔爾20000宣稱(chēng)是'提供一個(gè)量子跳轉'在倒裝芯片組裝技術(shù)的RFID嵌體。
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 釬料凸臺的制造是球柵陣列封裝(BGA, ball grid array)、芯片尺寸級封裝(CSP, chip scale packaging)及倒裝芯片封裝(FC, flip chip)等面陣封裝的關(guān)鍵技術(shù)之一。
