The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC).是什么意思_The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC).在線(xiàn)翻譯_英語(yǔ)_讀音_用法_例句