Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced.

 
  • 介紹了幾種當前先進(jìn)的MEMS封裝技術(shù):倒裝焊MEMS、多芯片 (MCP)和模塊式封裝(MOMEMS)。
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