CTE mismatch between silicon and BT board is so colossal that flip chip need filling underfill to keep the long-term reliability.

 
  • 因覆晶封裝結構中的矽晶片與有機基板間的熱膨脹系數差異頗大,故需填充底膠以確保其長(cháng)時(shí)可靠性。
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