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- The steam explosion and cooking pulping process is a method improved for chemico mechanical pulping. 噴爆蒸煮制漿可認為是改良的化學(xué)機械制漿技術(shù)。
- Chemical Mechanical Polishing (CMP) is the most effective way to achieve global planarization in semiconductor process. 化學(xué)機械拋光，是半導體制程中達到全域平坦化最有效的辦法，同時(shí)也是眾多制程中不可或缺的重要制程步驟。
- Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. 摘要:化學(xué)機械拋光是現在半導體產(chǎn)業(yè)中最常被使用的平坦化制程。
- Diamond disk conditioners have long served the semiconductor chemical mechanical polishing (CMP) process for polish pad dressing. 摘要鉆石修整器應用于化學(xué)機械拋光中拋光墊的修整，已有很長(cháng)的一段時(shí)間。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. 化學(xué)機械拋光，是目前半導體制程中達全域平坦化最有效的方式，同時(shí)也是許多制程中不可缺少的步驟。
- Boning, D., W. Moyne and T. Smith, “Run by Run Control of Chemical Mechanical Polishing,” IEEE Trans. CPMT (C), 19, 307-314 (1996). 周育樂(lè )，考慮制程使用時(shí)間之批次控制方法，臺灣大學(xué)工業(yè)工程研究所碩士論文，臺北，臺灣(2000)。
- G. Corlett, “Targeting Water Use for Chemical Mechanical Polishing,” Solid State Technology, Vol. 43, No. 6, pp. 201-206 (2000). 蔡明蒔，“化學(xué)機械研磨后清洗技術(shù)簡(jiǎn)介”，奈米通訊，第6卷，第1期，第21-27頁(yè)（1999）。
- Both high material removal rate(MRR) and smooth surface have to be achieved in primary chemical mechanical polishing(CMP) of hard disk substrates. 硬盤(pán)盤(pán)基片粗拋光必須在較高材料去除率的基礎上獲得高表面質(zhì)量。
- With compensation-oriented chemical mechanical polishing (CMP) as the carrier, the study elucidates the procedures of this method for the innovative research and development case. 以補償式化學(xué)機械拋光為載具，作為進(jìn)行創(chuàng )新研發(fā)之案例來(lái)闡述本方法之流程步驟。
- Chemical mechanical polishing (CMP) technology has been considered as the most effective local and global planarization technology for wafer and widely used in ULSI fabrication. 化學(xué)機械拋光(CMP)是目前唯一能夠實(shí)現硅片局部和全局平坦化的實(shí)用技術(shù)和核心技術(shù)，正廣泛地應用于IC制造中。
- Slurry flow weighs heavily on the performances of chemical mechanical polishing(CMP) process,wherein the pad surface will alter the flow features considerably. 拋光墊表面特性能可大大改變拋光液的流動(dòng)情況,從而影響化學(xué)機械拋光的拋光性能。
- This feature can be eliminated via mechanical polishing and followed by chemical etching, and hence only exciton line was observed for the damage-removed sample. 此篇論文中所有的化合物半導體單晶樣品，在做光學(xué)量測之前，皆有經(jīng)過(guò)機械磨光以及化學(xué)蝕刻的處理。
- Investment casting with stainless steel, carbon steel, alloy steel and heat treatment. Machining with CNC mirror polishing, mechanical polishing, electro polishing, parts assembly. And products of steel fabrication. 不銹鋼、碳鋼、合金鋼的精密鑄造、鑄件的熱處理、CNC機械加工、鏡面拋光、機械拋光、電解拋光、部件裝配及鋼結構件的生產(chǎn)。
- A set of conventional processing methods of vanadium and vanadium alloy specimens, including mechanical polishing, mechanical chemical polishing, chemical etching as well as relevant techniques and experiences is introduced. 摘要介紹了一種釩及釩基合金金相試樣的常規制樣方法，即試樣的機械磨光，機械化學(xué)拋光，化學(xué)侵蝕等技術(shù)和經(jīng)驗。
- By considering the effect of the soft layer and the deformation of the abrasive particles on the material removal in chemical mechanical polishing(CMP),the solid-solid contact mode of CMP was modified. 通過(guò)分析軟質(zhì)層的形成、作用以及納米磨料的自身變形對材料去除的影響,改進(jìn)了CMP過(guò)程的接觸力學(xué)模型;
- This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers.The emphasis is on Chemical Mechanical Polishing (CMP). 報告研究了半導體層的拋光技術(shù)，技術(shù)的發(fā)展趨勢以及產(chǎn)品，產(chǎn)品應用，并介紹了材料和設備供應商。
- A complete bright silver plating process for deluxe tableware including chemical polishing, mechanical polishing, degreasing, cleaning, nickle plating, silver plating and post-treatment is suggested. 介紹餐具光亮鍍銀的全套實(shí)用工藝，包括化學(xué)拋光、機械拋光、除蠟、除油、鍍鎳、鍍銀、以及鍍后處理等。
- The processing method is used for flattening the surface of the substrate of the film circuit, thus avoiding mechanical polishing which is complicated in process, and significantly reducing the cost. 本發(fā)明用于薄膜電路基片表面的平坦化處理，可以避免工藝復雜的機械拋光，從而大幅度降低成本。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry.The polishing pad is one of the primary consumables in CMP. 摘要:化學(xué)機械拋光，是目前半導體制程中達全域平坦化最有效的方式，同時(shí)也是許多制程中不可缺少的步驟。
- Give the table a good rub with this polish. 用這上光劑把桌子好好擦一擦。
