Chemical mechanical polishing (CMP) technology has been considered as the most effective local and global planarization technology for wafer and widely used in ULSI fabrication.

　
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  • 化學(xué)機械拋光(CMP)是目前唯一能夠實(shí)現硅片局部和全局平坦化的實(shí)用技術(shù)和核心技術(shù)，正廣泛地應用于IC制造中。
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