The processing method is used for flattening the surface of the substrate of the film circuit, thus avoiding mechanical polishing which is complicated in process, and significantly reducing the cost.

 
  • 本發(fā)明用于薄膜電路基片表面的平坦化處理,可以避免工藝復雜的機械拋光,從而大幅度降低成本。
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