By considering the effect of the soft layer and the deformation of the abrasive particles on the material removal in chemical mechanical polishing(CMP),the solid-solid contact mode of CMP was modified.

 
  • 通過(guò)分析軟質(zhì)層的形成、作用以及納米磨料的自身變形對材料去除的影響,改進(jìn)了CMP過(guò)程的接觸力學(xué)模型;
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