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- TO封裝TO packaging
- 光探測器TO封裝的高頻分析與改進(jìn)Analysis and Improvement on the High Frequency Effect of TO Packaging for Photodiodes
- TCP封裝TCPencapsulation
- 鋁封裝aluminum encapsulation
- 封裝變化Find what varies and encapsulate it
- UDP封裝UDP encapsulation
- IC封裝IC package
- 封裝膠encapsulation
- 3D封裝3D package
- CSP封裝CSP package
- LED封裝LED packaging
- 封裝輥sealing roller
- 薄膜封裝TCP: Tape Carrier package
- BGA封裝BGA packaged
- COB封裝COB assembly
- 被封裝到Call is encapsulated within the
- QFN封裝QFN packages
- SMT封裝SMT package
- SOT封裝SOT-package
- SiP封裝SiP
