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- QFN封裝QFN packages
- QFN封裝元件組裝工藝技術(shù)研究Research on QFN Soldering and Assembly
- 疊層QFNstacked QFN
- QFN器件QFN device
- 塑封QFN器件plastic packaging QFN device
- TCP封裝TCPencapsulation
- TO封裝TO packaging
- 鋁封裝aluminum encapsulation
- 封裝變化Find what varies and encapsulate it
- UDP封裝UDP encapsulation
- IC封裝IC package
- 封裝膠encapsulation
- 3D封裝3D package
- CSP封裝CSP package
- LED封裝LED packaging
- 封裝輥sealing roller
- 薄膜封裝TCP: Tape Carrier package
- BGA封裝BGA packaged
- COB封裝COB assembly
- 被封裝到Call is encapsulated within the
