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- IC封裝IC package
- 超薄型IC封裝技術(shù)packaging for ultra-thin ICs
- IC封裝的擴晶裝置結構設計Structural Design of Wafer Expansion Device for IC Encapsulation
- HDI和IC封裝用高性能覆銅板的開(kāi)發(fā)The Development of High Quality CCL for HDI and IC Package
- IC封裝設備劃片機的研制Development of Wafer Incision Machine for IC Encapsulation
- IC封裝熱壓模機合模機構設計與有限元分析Design and Finite Element Analysis for Clamping Unit of Auto Molding in IC Packaging
- 本產(chǎn)品是為IC封裝自動(dòng)貼片機及其貼片工藝而設計。This product design for IC assembly die bonding process on die bonder machine.
- IC卡IC-card
- TCP封裝TCPencapsulation
- TO封裝TO packaging
- IC門(mén)IC
- 鋁封裝aluminum encapsulation
- IC法IC method
- 封裝變化Find what varies and encapsulate it
- UDP封裝UDP encapsulation
- 模擬ICanalog IC
- 控制ICcontrol IC
- 封裝膠encapsulation
- 3D封裝3D package
- IC設計IC design
