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- 超薄型IC封裝技術(shù)packaging for ultra-thin ICs
- 超薄型圓片級芯片尺寸封裝技術(shù)Ultrathin Wafer Level Chip Size Package Technology
- 非接觸型IC卡The Untouched IC Card
- IC封裝IC package
- 應用噴墨技術(shù)的超薄型多層板的開(kāi)發(fā)Development of Super Thin Multilayer Board with Ink Jet Technology
- IC封裝的擴晶裝置結構設計Structural Design of Wafer Expansion Device for IC Encapsulation
- 超薄型層壓板ultra thin laminate
- IC封裝設備劃片機的研制Development of Wafer Incision Machine for IC Encapsulation
- 超薄型平板縫隙陣Super-thinner plate slots array
- 采用新型多層基板的多芯片組件封裝技術(shù)Packaging Technology for Multichip Module Using New Type Multilayer Substrate
- 超薄be ultra-thin
- 外型exterior
- 戶(hù)型house type
- 光纖布喇格光柵高溫敏封裝技術(shù)的研究High-sensitivity Fiber Bragg Grating Temperature Sensor with Polymer Jacket
- 筆型pen type
- 整型integer
- 電子封裝技術(shù)electronic encapsulating technology
- 運動(dòng)型motile
- 多芯片封裝技術(shù)multi-chip packaging(MCP) technology
- 表型phenotype
