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- SOT封裝SOT-package
- SOT型半導體元器件自動(dòng)編帶機的編帶裝置設計Development on the Taping Unit for SOT Semiconductor Component Taping Machine
- SOT型半導體自動(dòng)編帶封裝機編帶驅動(dòng)部分的研制The Driver System of a Automatic SOT Diode Tape Machine
- 這兩種器件均以?xún)煞N封裝類(lèi)型提供:LH,供表面安裝應用使用的SOT-23W微型低厚度封裝;以及UA,供過(guò)孔安裝使用的三引腳超小型單列直插式封裝(SIP)。Both devices are offered in two package styles: LH, a SOT-23W miniature low-profile package for surface-mount applications, and UA, a three-lead ultramini Single Inline Package (SIP) for through-hole mounting.
- TCP封裝TCPencapsulation
- TO封裝TO packaging
- 鋁封裝aluminum encapsulation
- 封裝變化Find what varies and encapsulate it
- UDP封裝UDP encapsulation
- IC封裝IC package
- 封裝膠encapsulation
- 3D封裝3D package
- CSP封裝CSP package
- LED封裝LED packaging
- 封裝輥sealing roller
- 薄膜封裝TCP: Tape Carrier package
- BGA封裝BGA packaged
- COB封裝COB assembly
- 被封裝到Call is encapsulated within the
- QFN封裝QFN packages
