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- SMT封裝SMT package
- 微電子封裝技術(shù)與SMT將攜手走向未來(lái)Microelectronic Packaging Technology and SMT Will Join Hands in the Future
- SMT和微電子封裝技術(shù)中有關(guān)專(zhuān)業(yè)術(shù)語(yǔ)的探討Probe Specialized Terms of SMT and Micro-electronics Packaging
- 有一定SMT生產(chǎn)線(xiàn)工藝經(jīng)驗(有銷(xiāo)售焊料產(chǎn)品經(jīng)驗者優(yōu)先)。Working experiences in SMT processing ( with experience in selling soldering materials will be priority-considered).
- TCP封裝TCPencapsulation
- SMT法method of SMT
- TO封裝TO packaging
- 鋁封裝aluminum encapsulation
- SMT焊點(diǎn)Surface mount technology solder joint
- SMT理論SMT theory
- 封裝變化Find what varies and encapsulate it
- UDP封裝UDP encapsulation
- SMT實(shí)訓SMT training
- IC封裝IC package
- SMT生產(chǎn)線(xiàn)SMT line
- 封裝膠encapsulation
- SMT實(shí)驗室SMT laboratory
- 3D封裝3D package
- 國家信息技術(shù)緊缺人才培養工程-SMT技術(shù)培訓項目認證課程Education Project for High-Demand IT Talent - SMT Technical Training Program
- CSP封裝CSP package
