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- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要對這種混合焊點(diǎn)進(jìn)行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要對形成的混合焊點(diǎn)進(jìn)行可靠性分析。
- The solder joint exceeds the strength of Type L tube in annealed temper. 這種焊料連接超過(guò)退火處理類(lèi)型L管道的強度。
- Solder end valves are limited by temperatures which affect the strength of the solder joint. 焊接連接端口閥門(mén)溫度限制在不影響焊接連接端口的強度范圍內。
- Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint. 皂化劑中所含成分，若不采用適當的抑制劑，將會(huì )侵蝕金屬表面，造成焊點(diǎn)鈍化。
- This paper discusses the factors of influencing thermal fatigue of solder joint in SMT and its research method. 本文研討了影響SMT焊接點(diǎn)熱疲勞性能的因素及研究方法。
- The results show that the residual moisture within underfill materials enhances the stress level in solder joint. 結果表明：在濕熱環(huán)境下，底充膠材料內部殘留的濕氣提高了焊點(diǎn)的應力水平。
- Important procedures for preparing a solder joint are graphically illustrated in this catalog on page 48. 焊料連接準備工作的重要步驟在本樣本第48頁(yè)中有圖文并茂的描述。
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面組裝技術(shù)(SMT)形成的產(chǎn)品，其焊點(diǎn)質(zhì)量直接影響到產(chǎn)品的可靠性和壽命。
- The quality of solder joint affects the reliability of the products produced by SMT directly. 由表面組裝技術(shù)(SMT)形成的產(chǎn)品,其焊點(diǎn)質(zhì)量直接影響到產(chǎn)品的可靠性。
- The solder will be dull looking and, if the gold content in the solder exceeds about 5%, the solder joint will be brittle. 焊點(diǎn)外觀(guān)將變得暗淡,此外,如果焊料中的金成分超過(guò)約5%25時(shí),焊點(diǎn)將會(huì )變脆。
- New developments in flux chemistries for lead-free pastes do not require nitrogen to achieve good wetting and solder joint integrity. 無(wú)鉛焊錫膏的焊劑化學(xué)的新發(fā)展可以做到不使用氮氣也可得到良好的熔濕性和焊點(diǎn)完整性。
- Under temperature cycling (thermomechanical fatigue) conditions, this Pb-rich phase tends to coarsen and eventually leads to solder joint cracking. 在溫度循環(huán)條件（即熱機械疲勞條件）下，富鉛相會(huì )變粗并最終導致焊點(diǎn)破裂。
- Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly. 焊點(diǎn)疲勞壽命通常是通過(guò)電子組件進(jìn)行溫度循環(huán)加速試驗來(lái)確定。
- Solder Joint - NIBCO pioneered the development of the solder joint and its application to the field of copper tube piping. 焊料連接-美國尼伯科公司是開(kāi)發(fā)焊料連接方式的先驅者，并將這種連接方式應用到銅管管道領(lǐng)域。
- Whether fatigue of solder joint and the location of the chip are related to the curvature and torsional curvature of PCB are discussed. 芯片焊點(diǎn)壽命的長(cháng)短和芯片所處位置的曲率和扭率都有關(guān)系,但是扭率對壽命的影響總是被忽略。
- Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL. 主要研究了不同氧含量對QFP引腳焊點(diǎn)拉伸強度的影響,得到一個(gè)最佳的氧含量范圍。
- Analyse the failure modes and mechanism of the mixed solder joint,and introduce the effect factors of reliability ulteriorly. 對混合焊點(diǎn)的失效形式和混合焊點(diǎn)的失效機理進(jìn)行了分析,并進(jìn)一步介紹了影響這類(lèi)焊點(diǎn)可靠性的因素。
- With the addition of combination flared-tube to solder joint fittings, as illustrated in Figure 1, these types of loops can be used when space or other limitations exist. 將組合擴口管道連接到焊料連接管件上，如圖1所示，這些類(lèi)型的循環(huán)回路可以用在存在空間或其他限制條件的地方。
- However, the solder joint reliability under thermal cycling conditions becomes a critical problem when mounting the WLP onto a PCB when the underfill layer has been eliminated. 然由于晶圓級構裝不填注底膠，因此當晶圓級構裝于組裝PCB基板后承受熱循環(huán)負載時(shí)，焊錫接點(diǎn)可靠度已成為構裝結構主要可靠度問(wèn)題之一。
