However, the solder joint reliability under thermal cycling conditions becomes a critical problem when mounting the WLP onto a PCB when the underfill layer has been eliminated.

　
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  • 然由于晶圓級構裝不填注底膠，因此當晶圓級構裝于組裝PCB基板后承受熱循環(huán)負載時(shí)，焊錫接點(diǎn)可靠度已成為構裝結構主要可靠度問(wèn)題之一。
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