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- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊規格的工作室尺寸。
- C194 copper alloy is one of the representative materials of lead frame. C194銅合金是最具代表性的引線(xiàn)框架材料之一。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自動(dòng)粘片機是將半導體晶圓微芯片貼裝到引線(xiàn)基架的半導體后工序關(guān)鍵性生產(chǎn)設備。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同時(shí)生產(chǎn)集成電路引線(xiàn)框架、熒光顯示屏、VFD陳列、柵網(wǎng)及塑料加工業(yè)務(wù)。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 導線(xiàn)架晶片座開(kāi)槽型式，對構裝翹曲及晶片應力也有明顯改善效果。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片機是用于將IC芯片粘結到引線(xiàn)框架的半導體器件生產(chǎn)專(zhuān)用裝備。
- Semiconductor manufacturing：reel-to-reel plating, pin plating, lead frame plating, deflashing, Spot plating and electro polishing etc. 半導體元器件電鍍：卷對卷電鍍，接觸器件電鍍，引線(xiàn)框架電鍍，電拋光，選擇性點(diǎn)鍍等
- The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important. 引線(xiàn)框架電鍍層的質(zhì)量直接影響著(zhù)鉭電容器的可焊性,所以引線(xiàn)框架電鍍層質(zhì)量的測定方法至關(guān)重要。
- The ideal requirement for lead frame material properties is that tensile strength, hardness and electrical conductivity are more than 600MPa, 180HV and 80%IACS respectively. 理想的引線(xiàn)框架材料的主要性能為：抗拉強度在600MPa以上，顯微硬度大于180HV，導電率大于80%25IACS。
- The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation. 由于在引線(xiàn)框架材料的后續封裝過(guò)程中材料需承受短時(shí)高溫使用條件,所以對其軟化溫度提出了很高的要求。
- The low-profile TLMx100x LED package consists of a reliable lead frame base embedded in a clear epoxy. 超薄TLMx100x封裝包含嵌入在清晰環(huán)氧樹(shù)脂中的可靠引線(xiàn)框基盤(pán)。
- Enclosures for protection against ionizing radiation Lead shielding units for 150 mm, 200 mm and 250 mm thick walls Part 1: Chevron units of 150 mm and 200 mm thickness??? 電離輻射防護屏障? 壁厚為150mm、200mm和250mm的鉛屏蔽裝置? 第一部分：150mm和200mm厚度的人字形裝置
- The single-sided fish defects of KFC copper alloys applied to lead frame produced by domestic corporation were studied and analyzed by energy spectrum analysis, SEM and metallographic analysis. 對國內某企業(yè)采用半連續鑄造生產(chǎn)的KFC引線(xiàn)框架帶材表面魚(yú)鱗狀缺陷進(jìn)行了分析和研究。
- The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure. 介紹了IC引線(xiàn)框架級進(jìn)沖模的特點(diǎn)并著(zhù)重講述了其排樣設計中的整形工位和模具結構中的卸料、微調和安全機構,可供精密級進(jìn)沖模設計參考。
- Be involved in part development in non-metal materials, like shader and LED frame housing etc. 參與非金屬材料零部件的開(kāi)發(fā)，如遮光罩、模塊等。
- Houston is an USA southwest part land traffic centre, 5 main stems and many highway lines memorial form of radiation lead to everywhere, city Zhou You is encircled by express highway. 休斯敦是美國西南部陸上交通中心，5條鐵路干線(xiàn)和多條公路線(xiàn)呈輻射狀通向各地，城周有高速公路環(huán)繞。
- The likely impact of a supernova's radiation led scientists in the past to speculate that one may have affected evolution on Earth. 過(guò)去，科學(xué)家們根據超新星輻射的可能作用,推測它可能會(huì )對地球上的進(jìn)化產(chǎn)生影響。
- The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation. 自動(dòng)沖切成形系統是半導體集成電路封裝引線(xiàn)框架后的加工專(zhuān)用系統。
- Lead frames are one of the most important component parts of discrete and IC devices,with the development of IC to high density,miniaturization. 引線(xiàn)框架材料是電子工業(yè)中不可缺少的重要原材料之一,隨著(zhù)集成電路向高密度,小型化,多功能化發(fā)展,對引線(xiàn)框架材料提出了新的要求。
- The horse forged ahead the lead in the homestretch. 那匹馬在最后階段突然加速跑到前面。
