The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.

 
  • 引線(xiàn)框架電鍍層的質(zhì)量直接影響著(zhù)鉭電容器的可焊性,所以引線(xiàn)框架電鍍層質(zhì)量的測定方法至關(guān)重要。
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