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- MEMS封裝中真空封口及真空度檢測技術(shù)Study of vacuum packaging and vacuum level testing technologies of MEMS packaging
- 介紹了幾種當前先進(jìn)的MEMS封裝技術(shù):倒裝焊MEMS、多芯片 (MCP)和模塊式封裝(MOMEMS)。Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced.
- MEMS封裝MEMS package
- 模塊式MEMS封裝MOMEMS
- MEMS封裝技術(shù)及標準工藝研究Study on MEMS Packaging Technology and Its Standard Process
- MEMS封裝用氮化鋁共燒基板研究The Study of Aluminum Nitride Co-fire Ceramic Substrate for MEMS Package
- MEMS真空封裝MEMS vacuum package
- MEMSmicro-electro-mechanical systems
- TCP封裝TCPencapsulation
- TO封裝TO packaging
- 3D-MEMS3DX-MEMS
- 鋁封裝aluminum encapsulation
- MEMS技術(shù)MEMS technology
- 封裝變化Find what varies and encapsulate it
- MEMS陀螺MEMS gyroscope
- UDP封裝UDP encapsulation
- MEMS器件MEMS device
- IC封裝IC package
- 柔性MEMSflexible MEMS
- 封裝膠encapsulation