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- Beijing JZGW Process Technology Co., Ltd. 北京九州格物過(guò)程技術(shù)有限公司。
- Beijing Tianli Process Technology Co., Ltd. 北京天利流程技術(shù)有限公司。
- Define and realize the detailed process technology (work stations). 負責確定和實(shí)現規定范圍的具體工藝(工位)。
- The process technology of ion-exchange film in the pharmaceutical indust. 對離子交換膜技術(shù)在醫藥工業(yè)中的應用工藝進(jìn)行探討。
- The process technology of bacteria-fermented Douchi was studied in thi s paper. 對細菌型豆豉的生產(chǎn)工藝作了深入研究。
- Hundreds of systems are in use in wafer processing applications throughout the world. 成千上百種系統廣泛應用于全球晶片工藝過(guò)程.
- bulk silicon dissolved wafer process 體硅溶片工藝
- A common distribution core that providesall electrical power, gases, chemicals, and other services to the sectors of an automated wafer processing system. 一種公共分配中心，向自動(dòng)化晶片處理系統中的各個(gè)部分提供所有的電源、氣體、化學(xué)原料和其它服務(wù)。
- First of all, the entire process technology and the bottling lines are scheduled for installation by September 2007. 首先,整套流程技術(shù)以及灌裝線(xiàn)必須在2007年9月前安裝完畢。
- The chemical is widely used in the production of LSI,VLSI and other semiconductors to remove photoresist edge bead that occurs during typical spin coat wafer processing. 該試劑用于清除勻膠后殘留于硅片邊緣及背面的光刻膠，已經(jīng)廣泛應用于中、大規模集成電路及其它半導體器件的生產(chǎn)。
- Study on the processing technology of Pholidota Chinensis Lindl. 石仙桃炮制工藝研究。
- A common distribution core that providesall electrical power, gases,chemicals, and other services to the sectors of an automated wafer processing system. 一種公共分配中心,向自動(dòng)化晶片處理系統中的各個(gè)部分提供所有的電源、氣體、化學(xué)原料和其它服務(wù)。
- Abstract: The key process technology of integrated thin- film resistor, capacitor and passive assembly was introduced. 摘要:介紹了國外集成薄膜電阻器、電容器及無(wú)源組件的關(guān)鍵工藝技術(shù)的研究情況。
- Processing Technology and Properties of MVQ/ACM Rubber. 硅橡膠/丙烯酸酯橡膠并用膠的加工與性能
- METHODS The processing technology made of wet granulation. 方法采用濕法制粒的制備工藝。
- A new processing technology of waxberry wine was studied. 本文研究了以楊梅為原料生產(chǎn)發(fā)酵型楊梅果酒的新工藝。
- Objective:Discusses the processing technology of semen euphorbiae. 目的:探討千金子制霜新工藝。
- Structure designing and key processing technologies for wafer level package(WLP) were studied. 對圓片級封裝(WLP)的結構設計和關(guān)鍵工藝技術(shù)進(jìn)行了研究;
- The processing technology of spicy crisp pigeonpea was studied. 研究了香酥木豆的加工工藝。
- The processing technology of crystallized yak paunch was studied. 探討了水晶牦牛肚的加工工藝。
