The chemical is widely used in the production of LSI,VLSI and other semiconductors to remove photoresist edge bead that occurs during typical spin coat wafer processing.

 
  • 該試劑用于清除勻膠后殘留于硅片邊緣及背面的光刻膠,已經(jīng)廣泛應用于中、大規模集成電路及其它半導體器件的生產(chǎn)。
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