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- The result indicated that the material removal rate of isopulse generator is over 20% higher than that of general pulse generator. 實(shí)驗結果表明，與普通脈沖電源相比,等能量脈沖電源可以提高加工效率20%25以上。
- This paper proposed a viewpoint to explain why vibration assistance may increase material removal rate (MRR) in vibration-assisted finishing process. 摘要討論振動(dòng)研磨加工過(guò)程中通過(guò)輔助振動(dòng)提高材料去除率的原因。
- Experiment results showed that WEDM in atmosphere offers advantages such as better straightness,shorter gap length and higher material removal rate. 實(shí)驗結果表明,氣中加工的直線(xiàn)度好、放電間隙窄、加工速度(材料去除率)高。
- Experiment results showed that WEDM in atmosphere offers advantages such as better straightness and higher material removal rate. 實(shí)驗結果表明,氣中線(xiàn)切割加工具有加工表面直線(xiàn)度好、加工速度(材料去除率)高等優(yōu)點(diǎn)。
- Both high material removal rate(MRR) and smooth surface have to be achieved in primary chemical mechanical polishing(CMP) of hard disk substrates. 硬盤(pán)盤(pán)基片粗拋光必須在較高材料去除率的基礎上獲得高表面質(zhì)量。
- Larger diamond crystals and greater diamond protrusion will result in a potentially faster material removal rate when there is enough horsepower available. 金剛石晶體和金剛石突較大將導致更大更快的物質(zhì)可能有足夠的去除率馬力刊物。
- With the optimized normal rake angle, machining force and temperature change less, but material removal rate is improved obviously with increasing cutting speed. 通過(guò)優(yōu)化刀具前角，提高切削速度，切削力和切削溫度變化較小，但是顯著(zhù)提高了材料去除率。
- The polishing pad is main consumables of the CMP system, the structure and surface roughness of pad have great effects on the material removal rate and surface roughness of wafer. 拋光墊是化學(xué)機械拋光(CMP)系統中的主要耗材之一，拋光墊的結構和表面粗糙度對CMP過(guò)程中的硅片材料去除率和表面粗糙度有很大影響。
- Ultrasonic is applied in slider lapping. Experiment show that material removal rate and the roughness of surface are improved. The pole tip recession (PTR) is reduced. 在硬盤(pán)磁頭拋光中加入超聲波,可以提高材料去除率、降低表面粗糙度值、減小極尖沉降。
- It is concluded that when the silicon and pad rotate with the same rotational velocity, the material removal rate (MMR) is proportional to the rotational velocity. 當晶片和墊板的轉動(dòng)角速度相同時(shí)，得出材料去除率(MMR)與墊板和晶片相對速度成正比的結論。
- A system for adaptive optimization of cutting parameters such as feed rate and spindle speed in a face milling operation for maximizing the material removal rate without violating machining constraints is set up. 基于以上算法 ,構造了平面銑削加工參數自適應優(yōu)化系統 ,可使加工系統在不違反加工約束的前提下 ,總是獲得最大材料去除率。
- The results show that under the same lapping conditions the Si3 N4 ball has the lowest material removal rate and the best roundness and roughness, followed by ZrO2, Al2O3, and SiC ball. 結果表明：在相同的研磨條件下，具有長(cháng)柱狀晶粒的氮化硅陶瓷球加工速率最低，但圓度和表面粗糙度最容易控制；氧化鋯和氧化鋁陶瓷球表面質(zhì)量次之，碳化硅陶瓷球加工速率最高，圓度和表面粗糙度最難控制。
- It is indicated that the optimal nonuniformity of wafer surface and material removal rate can be obtained under the wafer and the pad rotating in the same direction with the equal rotational speed. 分析結果表明：硅片與拋光墊轉速相等轉向相同時(shí)可獲得最佳的材料去除非均勻性及材料去除率。
- Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized. 通常情況下，剝離速度和切割速度都是很低的?；谄浔旧淼哪芰?lái)講，激光器沒(méi)有運行在最優(yōu)化的狀態(tài)下。
- Material Removal Rate Study of Wire Electrical Discharge Machining Pocketing 線(xiàn)電極放電銑削凹坑的材料去除率規律研究
- Effect on material removal rate of fluid jet polishing by several parameters 液體噴射拋光時(shí)各工藝參數對材料去除量的影響
- Let' s take the metal removal rate for example. 讓我們以金屬切削速率為例。
- The function and the acceptance condition of maximum material requirement (MMR) and reversible requirement (RR) were analyzed through dynamic tolerance figure. 通過(guò)動(dòng)態(tài)公差圖，分析了最大實(shí)體要求(MMR)及其可逆要求(RR)的功能及合格條件。
- Scraps or material removed when something is trimmed. 剪削，廢料從被修剪的東西上掉下來(lái)的碎屑
- The removal rate of NH3-N was up to 73.3%. 在脫氮模式中氨氮的去除率達到了73.;3%25；
