It is indicated that the optimal nonuniformity of wafer surface and material removal rate can be obtained under the wafer and the pad rotating in the same direction with the equal rotational speed.是什么意思_It is indicated that the optimal nonuniformity of wafer surface and material removal rate can be obtained under the wafer and the pad rotating in the same direction with the equal rotational speed.在線(xiàn)翻譯_英語(yǔ)_讀音_用法_例句