The polishing pad is main consumables of the CMP system, the structure and surface roughness of pad have great effects on the material removal rate and surface roughness of wafer.是什么意思_The polishing pad is main consumables of the CMP system, the structure and surface roughness of pad have great effects on the material removal rate and surface roughness of wafer.在線(xiàn)翻譯_英語(yǔ)_讀音_用法_例句