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- Desirable for high-performance Ball Grid Array (BGA) package. 高性能球形焊點(diǎn)陣列封裝需要倒裝焊。
- In this example, the area of the ball grid array (BGA) deposit appears normal but actually contains more than twice the expected volume and height. 在這個(gè)例子里，球柵陣列(BGA)焊膏沉積面積正常，但實(shí)際焊膏量大于期望量和期望高度的2倍。
- Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard. 按照JEDEC標準對板級跌落實(shí)驗的要求測試了有鉛和無(wú)鉛焊點(diǎn)的球柵陣列封裝。
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 釬料凸臺的制造是球柵陣列封裝(BGA, ball grid array)、芯片尺寸級封裝(CSP, chip scale packaging)及倒裝芯片封裝(FC, flip chip)等面陣封裝的關(guān)鍵技術(shù)之一。
- On the base of ULA (uniform linear array), supposing every ULA as a sub-ULA of 2-D array, different sub-ULA's DOA estimation will be made of DOA estimation of 2-D grid array. 以等距線(xiàn)陣為基礎，把每一線(xiàn)陣作為平面陣列的一個(gè)子線(xiàn)陣，信號在不同子線(xiàn)陣上形成的波達方向估計就構成平面陣列的波達方向估計。
- This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process. 中文摘要本文針對陣列錫球封裝產(chǎn)品基板和膠餅間所產(chǎn)生的分層作研究。
- The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. 摘要球格陣列封裝廠(chǎng)具有機臺整備時(shí)間長(cháng)、訂單動(dòng)態(tài)來(lái)到以及產(chǎn)品會(huì )再回流等三大特性。
- Start to work at FCI since 1998 as Ball grid array (BGA) connectors products marketing manger that was mainly targeted for CPU socket project in Note Book PC application during 1998 to 2000. 1998年加入FCI，1998年至2000年擔任球柵陣列（BGA）連接器產(chǎn)品（該產(chǎn)品主要面向筆記本電腦應用中的CPU插槽）市場(chǎng)經(jīng)理之職。
- Ball Grid Array Micro Pull Strength 球形柵格陣列微拉力測量
- Low-profile Fine pitch Ball Grid Array 小外型細間距球柵陣列
- The Ball Grid Array and Cleaning 球柵陣列器件及其清洗
- PPGA:(Plastic Pin Grid Array Package) 塑料插針矩陣封裝電腦常用縮略詞(二十)點(diǎn)對點(diǎn)協(xié)議
- Enhanced plastic ball grid array 增強型塑料球柵陣列
- Ultra thin Fine pitch Ball Grid Array 超薄細節距球柵陣列
- Metallized Ceramic - Pin Grid Array HPI 金屬化陶瓷-接腳柵格陣列
- CPGA: Ceramic Pin Grid Array Package 陶瓷針柵陣列封裝一點(diǎn)
- PBGA (plastic ball grid array) assembly PBGA組件
- top bottom ball grid array (TB-BGA) 上下球柵陣列封裝技術(shù)
- top bottom ball. grid array (TB-BGA) 上下球柵陣列
- Metallized Ceramic-Pin Grid Array 金屬化陶瓷-針柵陣列
