Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard.

 
  • 按照JEDEC標準對板級跌落實(shí)驗的要求測試了有鉛和無(wú)鉛焊點(diǎn)的球柵陣列封裝。
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