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- The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本課題受到國家自然科學(xué)基金重大項目“先進(jìn)電子制造中的重要科學(xué)技術(shù)問(wèn)題研究”的資助,專(zhuān)門(mén)針對RFID倒裝芯片封裝設備中的預綁定模塊進(jìn)行視覺(jué)系統和運動(dòng)控制集成的研究。
- Xinhua Packaging Factory mainly produces PE protection film , PE stretch film ,PE/PVC electrostatic protection film ,film plastic box composite membrane. 新華包裝材料廠(chǎng)專(zhuān)業(yè)生產(chǎn)：PE保護膜、PE拉伸膜、PE/PVC靜電保護膜、膠片膠盒復合膜。
- Copper Dual Damascene processing for chip metallization, and C4(Flip-chip) technologies of planar array chip packaging interconnection cause the electrochemical technologies place in the most complication processing for chip fabrication processing. Cu芯片金屬化的雙大馬士革處理和面陣列芯片封裝互連的C4(倒裝)技術(shù)使電化學(xué)技術(shù)置于最復雜的制造工藝技術(shù)之間。
- At the same time, China is taking on a grand scale semiconductor expansion plan to become the premier location for silicon foundry services, IC design, chip packaging, and testing. 同時(shí)，中國正計劃成為主要的芯片生產(chǎn)、IC設計、芯片封裝和測試的基地。
- Flip chip packaging market flips up 倒裝芯片封裝市場(chǎng)快速增長(cháng)
- There is barbed Sachet 4 rural processing plants, packaging factories l Department, led the development of the township, engaged in the industry of more than 300 personnel. 現建有香包刺鄉加工廠(chǎng)4處，包裝廠(chǎng)l處，帶動(dòng)全鄉從事這一產(chǎn)業(yè)開(kāi)發(fā)的人員達300多人。
- He is a great guy, a chip off the old block. 他是一位好人，就像他父親一樣。
- It is now our aim to set up a factory. 我們現在的目的是創(chuàng )辦一座工廠(chǎng)。
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成電路封裝（叩焊芯片）內部實(shí)際的電氣連接的焊料中的鉛。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等離子體400和660系列是低壓微波等離子體應用于提高模具粘合，引線(xiàn)的焊接，特別是清洗高級的芯片封裝。
- Based on the IBIS model, a simple method was proposed to estimate the simultaneous switching noise (SSN) of the high-speed chip package. 摘要基于BIS模型，提出了一種新穎、簡(jiǎn)單地估算高速芯片封裝結構同步開(kāi)關(guān)噪聲(SSN)的方法。
- The rapid development of microelectronic technology has been giving impetus to the development of new chip package technology. 摘要微電子技術(shù)的飛速發(fā)展也同時(shí)推動(dòng)了新型芯片封裝技術(shù)的研究和開(kāi)發(fā)。
- Toshiba dubs the peripheral chip package the ‘Super Companion Chip’ that includes audio and image interfaces supporting Cell's high data transfer capability. 日本東芝公司配音周邊的薄片包裝那 '超級朋友薄片' 那包括支援細胞高的數據移動(dòng)能力的聲音和圖像接口。
- Jack was assigned to the assembly shop of the factory. 杰克被分配到廠(chǎng)里的裝配間工作。
- Relied on the analysis and discussions of many measures for suppressing the SSN of the package, some design guidelines for the high-speed chip package with low SSN were presented. 基于對多種抑制封裝結構SSN措施的分析與討論，給出了低SSN的高速封裝結構設計原則。
- He piloted us through the large factory. 他領(lǐng)我們參觀(guān)了這個(gè)大工廠(chǎng)。
- Finally he got a job shifting rails in a factory. 最后他在一家工廠(chǎng)找到一個(gè)搬鋼軌的工作。
- An Overview of Non destructive Inspection in Flip Chip Packaging 倒裝焊芯片封裝中的非接觸檢測技術(shù)
- The average output of the factory is 20 cars a day. 該工廠(chǎng)的平均產(chǎn)量是每天20輛汽車(chē)。
- Our factory makes celluloid articles. 我們廠(chǎng)制造賽璐路制品。
