Copper Dual Damascene processing for chip metallization, and C4(Flip-chip) technologies of planar array chip packaging interconnection cause the electrochemical technologies place in the most complication processing for chip fabrication processing.
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- Cu芯片金屬化的雙大馬士革處理和面陣列芯片封裝互連的C4(倒裝)技術(shù)使電化學(xué)技術(shù)置于最復雜的制造工藝技術(shù)之間。
