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- Zn-Al釬料Zn-Al solder
- Mg-Al-Zn基合金釬料Mg - Al - Zn matrix alloy solders
- Al-Si-Cu-Zn-Re粉末釬料Al-Si-Cu-Zn-Re powders solder
- 釬料brazing filler metal
- Sn-Zn釬料Sn-Zn solder
- 利用周模型對Sn-Ag-Cu-Ce無(wú)鉛釬料合金體系進(jìn)行了熱力學(xué)計算預測。Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.
- 理查德釬料Richard's solder
- Al基釬料Al matrix filler metal
- Sn-Zn-Ag無(wú)鉛釬料Sn - 9Zn - Ag solder
- 鋁釬料Almit
- 釬料絲solder wire
- 鉛釬料lead solder
- 軟釬料low melting solder
- 釬料層filler metal layer
- 3P1釬料3P1 brazing alloy
- 鎳基釬料Nickel base brazing filler metals
- 錫釬料tin solder
- 鈷釬料cobalt braze
- 鋅釬料spelter solder; brazing brass
- 銀釬料silver-brazing alloy