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- Al基釬料Al matrix filler metal
- 鈦基釬料Ti-based brazing materials
- 鋅基釬料Zn-based brazing alloy
- Ni-Al基Ni-Al based
- 鋁基釬料Al-based brazing foils
- Al基合金Al-based alloy
- 銀基釬料Ag-based brazing seam alloy
- Ti-Al基合金Ti-Al-based alloy
- Al基軸承合金Al-based bearing alloy
- 釬料brazing filler metal
- Fe-Al基阻尼合金Fe-Al based damping alloys
- 銀基釬焊the Ag - based brazed alloy
- Fe-Cr-Al基合金Fe-Cr-Al based alloy
- 利用周模型對Sn-Ag-Cu-Ce無(wú)鉛釬料合金體系進(jìn)行了熱力學(xué)計算預測。Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.
- 銀基釬焊料膏Silver alloy low temperature brazing paste
- SiC／Al基復合材料SiC/Al composites
- 鋁釬料Almit
- SiCp/Al基復合材料SiCp/Al MMCs
- 釬料絲solder wire
- SiCp增強Al基復合材料SiCp reinforced Al matrix composite
