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- Sn3.5Ag0.5Cu釬料Sn3.5Ag0.5Cu solder
- 結果表明:Zn與Ag、Cu形成AgZn和CuZn3化合物,能顯著(zhù)細化Sn3.5Ag0.5Cu釬料組織,降低Sn3.5Ag0.5Cu釬料合金的潤濕性,同時(shí)可提高Sn3.5Ag0.5Cu釬料合金抗拉強度。The results show that Zn and Ag ? Cu can form the AgZn and CuZn3 compound and the microstructure of Sn3.5Ag0.5Cu solder is refined at the same time. Morever,the wettability of the Sn3.5Ag0.5Cu lead-free solder is reduced and its tension strength is improved by adding elements Zn in Sn3.5Ag0.5Cu solder.
- Sn3.5AgO.5Cu釬料Sn3.5Ag0.5Cu solder
- Sn-3.5Ag-0.5Cu釬料Sn-3.5Ag-0.5Cu solder
- 來(lái)料supplied materials
- 調味料flavouring
- 料號
- 領(lǐng)料單call slip
- 出料discharge port
- 上料loading
- 缺料starved feeding
- 主料mother stock
- 釬料brazing filler metal
- 鋁釬料Almit
- 釬料絲solder wire
- 鉛釬料lead solder
- 軟釬料low melting solder
- 釬料層filler metal layer
- 鈦基釬料Ti-based brazing materials
- Zn-Al釬料Zn-Al solder
