您要查找的是不是：
- Sn3.0Ag0.5CuCe釬料Sn3.0Ag0.5CuCe solder
- Sn3.5Ag0.5Cu釬料Sn3.5Ag0.5Cu solder
- Sn3.5AgO.5Cu釬料Sn3.5Ag0.5Cu solder
- 釬料brazing filler metal
- 利用周模型對Sn-Ag-Cu-Ce無(wú)鉛釬料合金體系進(jìn)行了熱力學(xué)計算預測。Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.
- 理查德釬料Richard's solder
- 鋁釬料Almit
- 結果表明:Zn與Ag、Cu形成AgZn和CuZn3化合物,能顯著(zhù)細化Sn3.5Ag0.5Cu釬料組織,降低Sn3.5Ag0.5Cu釬料合金的潤濕性,同時(shí)可提高Sn3.5Ag0.5Cu釬料合金抗拉強度。The results show that Zn and Ag ? Cu can form the AgZn and CuZn3 compound and the microstructure of Sn3.5Ag0.5Cu solder is refined at the same time. Morever,the wettability of the Sn3.5Ag0.5Cu lead-free solder is reduced and its tension strength is improved by adding elements Zn in Sn3.5Ag0.5Cu solder.
- 釬料絲solder wire
- 鉛釬料lead solder
- 軟釬料low melting solder
- 釬料層filler metal layer
- 3P1釬料3P1 brazing alloy
- 鎳基釬料Nickel base brazing filler metals
- 錫釬料tin solder
- 鈷釬料cobalt braze
- 鋅釬料spelter solder; brazing brass
- 銀釬料silver-brazing alloy
- 硬釬料hard solder
- 用鋁基釬料釬焊SiC陶瓷及其在SiC陶瓷表面浸潤性的研究Study on Brazing of SiC Ceramics with Aluminum base Filler Metals and Their Wettability on the Surface of SiC Substrates
