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- PBGA (plastic ball grid array) assembly PBGA組件
- PBGA Plastic Ball Grid Array 塑封球柵陣列器件
- Enhanced plastic ball grid array 增強型塑料球柵陣列
- PBGA (plastic ball grid array) 塑封球柵陣列封裝
- Thermal Stress Simulation for Plastic Ball Grid Array Package 塑料球柵陣列封裝的熱應力模擬
- Welding reliability of plastic ball grid array component 塑料封裝球柵陣列器件焊點(diǎn)的可靠性
- Reliability test and analysis of 1.27 mm pitch plastic ball grid array soldered joint under thermal shock 熱沖擊條件下1.;27 mm引腳間距塑封球柵陣列器件焊點(diǎn)可靠性測試與分析
- Solder Joint Reliability of Plastic Ball Grid Array Component Based on Design of Full Factorial Experiment 基于全面析因試驗的塑封球柵陣列器件焊點(diǎn)可靠性
- Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design 基于正交試驗設計的塑封球柵陣列器件焊點(diǎn)工藝參數與可靠性關(guān)系研究
- Plastic Ball Grid Array Package 塑料焊球陣列封裝
- Plastic Ball Grid Array 塑料球格子陣
- Desirable for high-performance Ball Grid Array (BGA) package. 高性能球形焊點(diǎn)陣列封裝需要倒裝焊。
- In this example, the area of the ball grid array (BGA) deposit appears normal but actually contains more than twice the expected volume and height. 在這個(gè)例子里，球柵陣列(BGA)焊膏沉積面積正常，但實(shí)際焊膏量大于期望量和期望高度的2倍。
- Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard. 按照JEDEC標準對板級跌落實(shí)驗的要求測試了有鉛和無(wú)鉛焊點(diǎn)的球柵陣列封裝。
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 釬料凸臺的制造是球柵陣列封裝(BGA, ball grid array)、芯片尺寸級封裝(CSP, chip scale packaging)及倒裝芯片封裝(FC, flip chip)等面陣封裝的關(guān)鍵技術(shù)之一。
- This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process. 中文摘要本文針對陣列錫球封裝產(chǎn)品基板和膠餅間所產(chǎn)生的分層作研究。
- The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. 摘要球格陣列封裝廠(chǎng)具有機臺整備時(shí)間長(cháng)、訂單動(dòng)態(tài)來(lái)到以及產(chǎn)品會(huì )再回流等三大特性。
- Start to work at FCI since 1998 as Ball grid array (BGA) connectors products marketing manger that was mainly targeted for CPU socket project in Note Book PC application during 1998 to 2000. 1998年加入FCI，1998年至2000年擔任球柵陣列（BGA）連接器產(chǎn)品（該產(chǎn)品主要面向筆記本電腦應用中的CPU插槽）市場(chǎng)經(jīng)理之職。
- Ball Grid Array Micro Pull Strength 球形柵格陣列微拉力測量
- Low-profile Fine pitch Ball Grid Array 小外型細間距球柵陣列
