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- Sn0.7Cu釬料Sn0.7Cu solder
- Sn-O.3Ag-0.7Cu-xBi釬料Sn-0.3Ag-0.7Cu-xBi solder
- Sn-0.3Ag-0.7Cu-xNi釬料Sn-0.3Ag-0.7Cu-xNi solder
- Sn-2.5Ag-0.7Cu（0.1RE）釬料Sn-2.5Ag-0.7Cu(0.1 RE) solder alloy
- 釬料brazing filler metal
- 利用周模型對Sn-Ag-Cu-Ce無(wú)鉛釬料合金體系進(jìn)行了熱力學(xué)計算預測。Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.
- 理查德釬料Richard's solder
- 鋁釬料Almit
- 釬料絲solder wire
- 鉛釬料lead solder
- 軟釬料low melting solder
- 釬料層filler metal layer
- 3P1釬料3P1 brazing alloy
- 鎳基釬料Nickel base brazing filler metals
- 錫釬料tin solder
- 鈷釬料cobalt braze
- 鋅釬料spelter solder; brazing brass
- 銀釬料silver-brazing alloy
- 硬釬料hard solder
- 用鋁基釬料釬焊SiC陶瓷及其在SiC陶瓷表面浸潤性的研究Study on Brazing of SiC Ceramics with Aluminum base Filler Metals and Their Wettability on the Surface of SiC Substrates
