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- Sn-Ag-Cu無(wú)鉛焊點(diǎn)Sn-Ag-Cu lead-free joints
- Sn.Ag-Cu無(wú)鉛釬料Sn-Ag-Cu lead-free solder
- 微量稀土元素鈰對Sn-Ag-Cu無(wú)鉛釬料物理性能和焊點(diǎn)抗拉強度的影響Effects of rare-earth element Ce on physical properties and mechanical properties of Sn-Ag-Cu lead-free solder
- Sn-Ag-Cu無(wú)鉛釬料Sn-Ag-Cu lead-free solder
- 按照JEDEC標準對板級跌落實(shí)驗的要求測試了有鉛和無(wú)鉛焊點(diǎn)的球柵陣列封裝。Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard.
- 無(wú)鉛焊點(diǎn)lead-free solder joint
- 無(wú)鉛焊點(diǎn)的可靠性研究Research on Lead-Free Solder Joint Reliability
- 這些合金具有較高的熔融溫度,對金屬表面的熔濕也較慢,焊點(diǎn)表面也不如錫-鉛焊點(diǎn)光亮。These alloys have higher melting temperatures and wet metal surfaces more slowly, the joints also look different in that the surfaces are not as reflective as tin-lead joints.
- 無(wú)鉛unleaded
- 無(wú)鉛合金Sn-Ag-CuSn-Ag-Cu lead-free alloy
- 矩形片狀元件無(wú)鉛焊點(diǎn)斷裂機制Fracture mechanism of lead-free soldered joints of rectangular chip component
- 無(wú)鉛的lead-free
- 無(wú)鉛汽油white gasoline
- 無(wú)鉛釉lead free glaze
- Sn-Ag基無(wú)鉛焊料的研究與發(fā)展The Research and Development of Pb-free Sn-Ag Base Solders
- 無(wú)鉛焊點(diǎn)可靠性測試和數據分析Lead-Free Solder-Joint Reliability Tests and Data Analysis
- 無(wú)鉛漆leadless paint
- 無(wú)鉛辛烷值unleaded octane rating
- 無(wú)鉛焊Pb- free
- 無(wú)鉛化unleaded
