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- Cu-Ni-Be合金Cu-Ni-Be alloy
- 微量Mg對 Ni-2.5%Be合金組織、性能和熱處理制度的影響Influence of trace Mg on the microstructure properties and heat treatment regime of alloy Ni-2.5 wt%25Be
- 結果表明:(1)Cu-Be合金活化后,表面生成較為純凈的BeO層。 氧化使得ESCA Be 1 S峰由111.6eV(電子結合能)移至113.6eV,使得Be KLL Auger峰由104eV(電子動(dòng)能)移至約93eV;The results show that (1) after activation a clean BoO layer formed on the surface of CuBe alloy, The ESCA peak Bels shifts from 111.6 eV (binding energy) to 113.6eV and the Auger peak Be kLL shifts from 104eV (electron energy) to about 93 eV with oxidation of Be.
- Cu-Ni-Cr-Be-Ti合金Cu-Ni-Cr-Be-Ti alloy
- Cu/NiCu/Ni
- Ni-Cu-PNi-Cu-P
- Be-Al合金Be-Al alloys
- Ni合金Ni alloy
- Cu／NiCu/Ni
- W／Cu合金W/Cu alloy
- Cu-Ag合金Cu-Ag alloy
- Ti-Cu-NiTi-Cu-Ni
- Ni-P合金Ni-P alloy
- Ni-Co合金Ni-Co alloy
- Cu-Ni團簇Cu-Ni clusters
- Cu-Sn合金Cu-Sn alloy
- Mo-Cu合金Mo-Cu alloy
- Cu-Ni-SiCu-Ni-Si
- Zn-Ni合金Zn-Ni alloy
- Ni基合金Ni-based alloy
