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- Cu互連工藝中Ta基擴散阻擋層的二次離子質(zhì)譜剖析Analysis of Ta-based Barrier Layer of Cu-interconnect by Second Ion Mass Spectrometry
- Al-Cu互連Al-Cu interconnect
- 互連interconnection
- Al／CuAl/Cu
- Cu-Al合金Cu-Al alloy
- Cu互連Cu metallization
- Al-Cu共晶Al-Cu eutectic
- Cu-Al-MnCu-Al-Mn
- Cu互連線(xiàn)Cu interconnects
- Al-Cu-FeAI-Cu-Fe
- Cu大馬士革互連Cu Damascene interconnects
- Al-Cu鑄件Al-Cu casting
- Al-Cu-Mg-AgAl-Cu-Mg-Ag
- Al-4%Cu合金Al-4%25Cu alloy
- Al-Zn-Mg-CuAl-Zn-Mg-Cu
- Cu-Al-Y合金Cu-Al-Y alloy
- Al-Cu擴散偶Al-Cu couple
- Al-Cu-Fe-BAl-Cu-Fe-B
- Al-Si-Cu-ZnAl-Si-Cu-Zn filler metal
- Al基Cu薄膜Al-based Cu film
