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- 芯片尺寸封裝(CSP)技術(shù)The Chip Size Package Technology
- 超薄型圓片級芯片尺寸封裝技術(shù)Ultrathin Wafer Level Chip Size Package Technology
- 芯片尺寸封裝CSP
- 疊層芯片尺寸封裝Stacked chip scale package
- 晶圓級芯片尺寸封裝技術(shù)及其應用Wafer Level Chip Size Package Technology and its Applications
- 圓片級芯片尺寸封裝wafer-level chip scale packaging
- 晶圓級芯片尺寸封裝WCSP
- 珠鋼CSP軋機控制技術(shù)特點(diǎn)TYPICAL OF CONTROL TECHNOLOGIES FOR CSP FINISHING-MILL IN ZHUJIANG STEEL PLANT CSP MILL
- CSP封裝CSP package
- 為適應底部CSP較大的球體尺寸及使用焊膏和助焊劑,對上述技術(shù)必須進(jìn)行某些改動(dòng)。Some modifications are required to accommodate the larger ball size of the bottom CSP as well as the use of solder paste in addition to flux.
- 微粒速度與尺寸同時(shí)測量的技術(shù)Research on Measuring the Speed and Dimension of Corpuscle
- 表面封裝技術(shù)SMT - Surface Mount Technology
- 晶圓尺寸級封裝WLCSP
- 豬源致病性沙門(mén)氏菌耐藥基因PCR和基因芯片檢測技術(shù)研究PCR and Gene Chip Detection Methods of Antimicrobial Resistance Genes of Pathogenic Salmonella from Swine
- 針對工件尺寸測量的現場(chǎng)標定技術(shù)Field Calibration Technique for the Dimension Measurement of the Work Piece
- 單封裝芯片SANYO Ultimate Super One Chip
- 也門(mén)塔維拉6井大尺寸套管修復技術(shù)Repairing technology for casing of large size of Well Taveira-6 in Yemen
- 芯片封裝專(zhuān)利chip packaging patent
- 基于回收的磨損尺寸脹修恢復技術(shù)Abraded Dimension Restore Technology by Elastic-Plastic Deformation for Recycling
- 芯片規模封裝Chip scale package