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- 電鍍Ni（Bi）electroplating Ni(Bi)
- 電鍍Nielectro-deposited nickel
- 電鍍galvanization
- 研究了電鍍Ni層和化學(xué)鍍Ni P合金層對Sn Ag/Cu焊點(diǎn)擴散行為的影響 ,電子探針?lè )治霰砻?:化學(xué)鍍Ni P合金層能很好地阻止Sn Ag/Cu焊點(diǎn)在焊接過(guò)程中的Cu ,Sn互擴散和相互反應 ;The effects of electroplated Ni layer and electroless plated Ni P layer on the diffusion behavior in Sn Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni P layer acted as a good diffusion barrier between Sn Ag solder and Cu substrate.
- BI-1BI-1
- 電鍍的electroplating
- Bi相Bi Phase
- 富BiBi excess
- Ni-PNi-P
- Bi元素bismuth element
- 電鍍液plating solution
- 7-NI7-Nitroindazole
- Bi-補償bistatic compensation
- Ag-NiAg-Ni
- BI廢水BI organic wastewater
- 電鍍槽plating bath
- 鍍Ninickel plated
- Bi薄膜Bi film
- 電鍍鉸鏈a galvanized hinge
