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- 無(wú)鉛BGA封裝lead-free BGA assembly
- 無(wú)鉛BGA封裝可靠性的跌落試驗及焊接界面微區分析Mechanical Test on Reliability of Lead-free BGA Assembly and Microstructure Analysis of Soldering Interface
- 無(wú)鉛BGA再加工時(shí)需要考慮的主要問(wèn)題是什么?What are the main concerns associated with reworking lead-free BGAs?
- BGA封裝BGA packaged
- 一種適用于無(wú)鉛BGA的返修方法An Adapt Way of Lead Free BGA Rework
- 無(wú)鉛封裝lead-free package
- 無(wú)鉛漆leadless paint
- 含鉛/無(wú)鉛汽油leaded/unleaded petrol
- 無(wú)鉛快燥磁漆leadless quick-drying enamel
- 無(wú)鉛釬料lead-free solder
- 無(wú)鉛焊料lead-free solder
- 無(wú)鉛焊點(diǎn)lead-free solder joint
- 無(wú)鉛焊膏lead-free solder paste
- 無(wú)鉛焊接Lead - free soldering
- 無(wú)鉛熔塊lead-free frit
- 無(wú)鉛無(wú)鎘leadless and cadmiumless
- 無(wú)鉛干料lead-free drier
- 無(wú)鉛兼容lead free compatible
- 無(wú)鉛陶瓷lead-free ceramics
- 無(wú)鉛黃銅nonleaded brass
