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- 疊層3D封裝技術(shù)stacked 3D packaging technology
- 疊層封裝Multi-Stack package
- 層layer
- 采用新型多層基板的多芯片組件封裝技術(shù)Packaging Technology for Multichip Module Using New Type Multilayer Substrate
- 疊層芯片封裝stacked die package
- 連續疊層技術(shù)non stop lamination
- 敞開(kāi)式、錯疊層、大跨度預應力板柱體系停車(chē)樓建筑技術(shù)研究應用Architectural Techniques Study and Application of the Open-type and Large Span Storied Garage Building in Split Level with Lamination and Prestressed Slab Column Structure System
- 疊層芯片封裝元件SCSP
- 疊層灰巖stromatolithic limestone
- 褶疊層pleat
- 磁疊層magnetic lamination
- 雙疊層double stacks
- 堆疊層stack layer
- 上疊層superimposed layer
- 疊層拱lamella arch
- 疊層管stacked tube
- 疊層梁laminated beam
- 疊層煤laminated coal
- 疊層木laminwood
- 疊層學(xué)stromatology
