With the rapid development of electronic electroplating industry, there are increasingly stringent requirements on the quality of the claddings, especially on the weldability. 摘要隨著(zhù)電子電鍍工業(yè)的飛速發(fā)展，鍍層質(zhì)量的要求也越來(lái)越高，尤其是在可焊性方面更為突出。
The test results show that the modifying solder has good solderability,whereas,the excellent flux is rosin-ethanol or rosin-isopropanol solution. 在熔融狀態(tài)下無(wú)鉛焊料合金的行為是影響電子產(chǎn)品微連接釬焊性的關(guān)鍵因素。
