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- This paper discusses the factors of influencing thermal fatigue of solder joint in SMT and its research method. 本文研討了影響SMT焊接點(diǎn)熱疲勞性能的因素及研究方法。
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面組裝技術(shù)(SMT)形成的產(chǎn)品，其焊點(diǎn)質(zhì)量直接影響到產(chǎn)品的可靠性和壽命。
- The quality of solder joint affects the reliability of the products produced by SMT directly. 由表面組裝技術(shù)(SMT)形成的產(chǎn)品,其焊點(diǎn)質(zhì)量直接影響到產(chǎn)品的可靠性。
- Whether fatigue of solder joint and the location of the chip are related to the curvature and torsional curvature of PCB are discussed. 芯片焊點(diǎn)壽命的長(cháng)短和芯片所處位置的曲率和扭率都有關(guān)系,但是扭率對壽命的影響總是被忽略。
- Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula. 在此基礎上,利用Coffin-Manson經(jīng)驗修正公式預報了焊點(diǎn)的熱疲勞壽命。
- Analyse of the Failure Mode of Solder Joint 焊點(diǎn)的失效模式與分析
- thermal fatigue life of solder joint 焊點(diǎn)熱疲勞壽命
- The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging. 在電子元件的設計和電子封裝的可靠性評估中焊點(diǎn)的熱-機械可靠性是一個(gè)關(guān)鍵的因素。
- What phase of mathematics are you studying now? 你在學(xué)習哪一方面的數學(xué)?
- The program is interfaced with the program Evolver which is used to predict the global shape of solder joints, and sectional profiles of solder joints can be obtained quickly and observed directly. 這說(shuō)明，不同的工藝參數對應的焊點(diǎn)的空間曲面特征是不同的，而考慮焊點(diǎn)的三維曲面特征在焊點(diǎn)工藝設計及焊點(diǎn)可靠性分析中是極為重要的。
- Virion The extracellular inert phase of a virus. 病毒(成熟)粒子：病毒在宿主細胞外以靜止狀態(tài)存在的結構。
- It assumes some phase of flowing. 可以設想會(huì )發(fā)生某些流動(dòng)現象。
- It was a very important phase of history. 它是一個(gè)非常重要的歷史階段。
- Failure Analysis and Improvement of Solder Joint under Ultrasonic Vibration 超聲波振動(dòng)激勵下焊點(diǎn)失效分析與改進(jìn)
- They looked into the various phases of the problem. 他們研究了問(wèn)題的各個(gè)方面。
- This was the third phase of his ascent. 這是他上升的第三階段。
- Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology 細微間距器件焊點(diǎn)形態(tài)成形建模與預測
- Waiting here is but a phase of our existence. 等候在這不過(guò)是我們存在的階段之一。
- Follow these steps for this phase of the recovery. 在此恢復階段,請按照以下步驟操作。
- Is the sequence of Solder Paste height measurements defined? 錫膏厚度的測量順序是否指定?
