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- Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Boards 多層印制線(xiàn)路板的選擇芯結構指南
- Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多層印制板用芯板結構選擇導則
- multilayer printed wiring board 多層印刷布線(xiàn)板
- Do the printed wiring boards have to be lead-free? 印刷線(xiàn)路板必須是無(wú)鉛的嗎?
- In the multilayer printed circuit boards (PCBs), the through-hole via transitions are always utilized to link the signal traces between different layers. 在多層印刷電路板當中，連通柱結構總是被用來(lái)連結位于不同層的傳輸線(xiàn)。
- Estimates are that 60-70% of printed wiring boards are tin-lead solder coated, usually by hot air solder leveling (HASL). 據估計,60-70%25的印刷線(xiàn)路板都帶有錫-鉛涂層,該涂層通常借助熱空氣焊料均涂(HASL)方法進(jìn)行涂敷。
- In dielectrics are available on the electrical connections between components of conducting a graphic that is referred to as printed wiring. 在絕緣基材上提供元器件之間電氣連接的導電圖形，稱(chēng)為印制線(xiàn)路。
- Part 2 : specifications.Specification number 17 : thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board. 印刷電路用基材.;第2部分:規范
- Further, since the chip capacitors (20) are received in a thick core board (30), there is no possibility of thickening the printed wiring board. 另外，因為在厚的核心基板30中容納了片狀電容器20，所以印刷布線(xiàn)板不會(huì )變厚。
- The solder coatings are applied to the copper surfaces of the printed wiring board to preserve solderability and protect the copper conductors from environmental corrosion. 焊料涂層被涂敷到印刷線(xiàn)路板的銅表面上,不僅可以保持可焊性,同時(shí)還可以保護銅導體免受環(huán)境腐蝕。
- It is easier to print wire services dispatches than have a reporter on the beat. 刊登通訊社的電訊稿比派記者到現場(chǎng)采訪(fǎng)要容易。
- SMPB Sequential Multilayer Printed Board 多層印制板
- Lamination Process of Multilayer Printed Board 多層板壓合制程
- Microstrip multilayer printed circuit board 微帶板
- flexible multilayer printed board 撓性多層印制板
- multilayer printed circuit board 多層印刷電路板,多層印制板
- flex-rigid multilayer printed board 剛-撓多層印制板
- Enthone manufactures, markets and distributes its functional, decorative and electronic processes that are used in printed wiring board (PWB), semiconductor, automotive, aerospace, jewelry, and hardware and plumbing applications. 樂(lè )思生產(chǎn)并銷(xiāo)售其功能性、裝飾性及電子電鍍工藝，這些工藝適用于印刷電路板、半導體、汽車(chē)、航空、珠寶、五金及衛浴等工業(yè)。。
- Arranging chip capacitors (20) in a printed wiring board (10) makes it possible to reduce the distance between an IC chip (90) and the chip capacitor (20) and to reduce the loop inductance. 因為在印刷布線(xiàn)板10內設置了片狀電容器20，所以能夠縮短IC芯片90與片狀電容器20的距離，降低環(huán)線(xiàn)電感。
- DC POWER BUS DECOUPLING ON MULTILAYER PRINTED CIRCUIT BOARD(PCB) 多層印制電路板電源去耦的研究
