Some key problems in developing lead-free solder were analyzed and some suggestions of solving the problems were put forward. 分析了無(wú)鉛釬料研究必須解決的幾個(gè)關(guān)鍵問(wèn)題，并提出了解決這些問(wèn)題的思路和建議。
And techniques to make lead-free solder bumping with electroplating are illustrated. 重點(diǎn)闡述了采用電鍍制作無(wú)鉛焊料凸點(diǎn)的方法。
The test results show that the modifying solder has good solderability,whereas,the excellent flux is rosin-ethanol or rosin-isopropanol solution. 在熔融狀態(tài)下無(wú)鉛焊料合金的行為是影響電子產(chǎn)品微連接釬焊性的關(guān)鍵因素。
