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- This paper discusses the factors of influencing thermal fatigue of solder joint in SMT and its research method. 本文研討了影響SMT焊接點(diǎn)熱疲勞性能的因素及研究方法。
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面組裝技術(shù)(SMT)形成的產(chǎn)品，其焊點(diǎn)質(zhì)量直接影響到產(chǎn)品的可靠性和壽命。
- The quality of solder joint affects the reliability of the products produced by SMT directly. 由表面組裝技術(shù)(SMT)形成的產(chǎn)品,其焊點(diǎn)質(zhì)量直接影響到產(chǎn)品的可靠性。
- Whether fatigue of solder joint and the location of the chip are related to the curvature and torsional curvature of PCB are discussed. 芯片焊點(diǎn)壽命的長(cháng)短和芯片所處位置的曲率和扭率都有關(guān)系,但是扭率對壽命的影響總是被忽略。
- Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula. 在此基礎上,利用Coffin-Manson經(jīng)驗修正公式預報了焊點(diǎn)的熱疲勞壽命。
- Analyse of the Failure Mode of Solder Joint 焊點(diǎn)的失效模式與分析
- thermal fatigue life of solder joint 焊點(diǎn)熱疲勞壽命
- The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging. 在電子元件的設計和電子封裝的可靠性評估中焊點(diǎn)的熱-機械可靠性是一個(gè)關(guān)鍵的因素。
- The program is interfaced with the program Evolver which is used to predict the global shape of solder joints, and sectional profiles of solder joints can be obtained quickly and observed directly. 這說(shuō)明，不同的工藝參數對應的焊點(diǎn)的空間曲面特征是不同的，而考慮焊點(diǎn)的三維曲面特征在焊點(diǎn)工藝設計及焊點(diǎn)可靠性分析中是極為重要的。
- Failure Analysis and Improvement of Solder Joint under Ultrasonic Vibration 超聲波振動(dòng)激勵下焊點(diǎn)失效分析與改進(jìn)
- Is the sequence of Solder Paste height measurements defined? 錫膏厚度的測量順序是否指定?
- Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology 細微間距器件焊點(diǎn)形態(tài)成形建模與預測
- Other techniques include the use of solder wick or hot gas heating. 還可應用其他技術(shù)，如采用吸焊料芯和熱氣加熱。
- The reliability of soldered joints of electronic devices in surface mount technology is a key factor for the extensive application of electronic products. 表面組裝器件焊點(diǎn)的可靠性問(wèn)題是電子產(chǎn)品能夠廣泛應用的關(guān)鍵問(wèn)題。
- Abstract: The interface microstructures of soldered joints under different soldering techniques were observed and analyzed.The interface reaction during soldering was studied. 摘 要: 觀(guān)察了不同焊接工藝條件下釬焊接頭界面的微觀(guān)結構，并對釬焊過(guò)程中的界面反應進(jìn)行分析。
- The stator is composed of laminations of high-grad sheet steel. 定子是由高質(zhì)量的薄鋼片疊制而成。
- Expert-System Evaluation of the Quality of Solder Joint and Software Achievement SMT焊點(diǎn)質(zhì)量的智能評價(jià)系統及其軟件實(shí)現
- Depth of Solder Penetration drastically affects the breaking load of the joint. 焊料滲透深度是影響連接部分斷裂負載能力的最主要因素。
- A better transition layer material was confirmed,which overcame the problem of fragmentation and lamination of PDC. 確定了一種效果較好的過(guò)渡層,較好地解決了金剛石/硬質(zhì)合金復合片碎裂及分層的問(wèn)題。
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要對這種混合焊點(diǎn)進(jìn)行可靠性分析。
