This superior reliability comes from advances in packaging techniques and epitaxial structure, together with the use of hard solder construction. 這種超級可靠性來(lái)自于封裝技術(shù)和外延結構的發(fā)展，也得益于硬焊接架構的使用。
The presence of a dent, tube ends which are not reamed or deburred before soldering, and sudden changes in direction can all cause localized high velocity conditions. 在焊料焊接之前，沒(méi)有修整或清理毛刺的管道端口以及管道坑的存在，或者流體的突然轉向，都可能產(chǎn)生導致局部高流速的原因。
