An integrated circuit, for example, may consist of a silicon die, die attach material, epoxy underfill, mould compound, leads, and lead plating materials. 例如一個(gè)集成電路芯片的組成由硅基模，模固定材料，環(huán)氧樹(shù)脂填充物質(zhì)，模壓成分，導線(xiàn)，導線(xiàn)鍍層材料。
Controls must be recessed inside the punch or die shoe and facing the operator. 控制開(kāi)關(guān)必須凹入面對操作者一側的沖頭或模座內。
Return springs and rods must be adequately protected from handling damage if they extend beyond the edge of the die shoe. 如果驅動(dòng)彈簧及鑼稈伸出模座外應充分的保護避免搬運破壞。
Controls must be recessed inside the punch or die shoe and facing the operator. 控制開(kāi)關(guān)必須凹入面對操作者一側的沖頭或模座內。
Return springs and rods must be adequately protected from handling damage if they extend beyond the edge of the die shoe. 如果驅動(dòng)彈簧及鑼稈伸出模座外應充分的保護避免搬運破壞。
