With the raise of pH value of electroless nickel plating solution, content of phosphorus in deposit was lowered, and moreover, Ni(OH)_2 was probably precipitated and mingled with Ni-P deposit which resulted in ascension of resistance.

 
  • 化學(xué)鍍鎳溶液pH值升高,鍍層磷含量降低,同時(shí)可能生成Ni(OH)2沉淀夾雜在鍍層中,從而使電阻升高;
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