Today, a wide variety of materials and fabrication techniques enable suppliers to design stencils that meet the assembly challenges of fine-pitch technology, miniaturized components and densely packed boards.

 
  • 今天,多種多樣的材料和制造技術(shù)時(shí)供應商能設計出的鋼網(wǎng)能迎接細微坡度,小型化部品和高密度封裝電路板的挑戰。
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